The processing of Ag-20Pd thick film metallisation conductors on AlN substrates has been investigated. The conductor films performed almost as well on the AlN substrate as on an Al2O3 substrate. During sintering, the glass frit melts and flows towards the substrate, while the Ag-Pd powder sinters to form a porous structure. As a result an intricate physical bond forms between the Ag-Pd conductor layer and the glass, and the glass wets and bonds firmly to the AlN substrate. In order to achieve this microstructure at the conductor/substrate interface, it is necessary for the glass to have an optimum softening point (500-600°C) and to wet the metal and the AlN substrate.
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