Dynamic recrystallization of Cu single crystals during tensile deformation in creep

Abstract

Dynamic recrystallization (DRX) of Cu single crystals during tensile deformation in creep at elevated temperatures (0·6 ≤ T/T _m ≤ 0·9) was investigated. At very high temperatures (T ≤ 0·8 T _m), DRX occurred after steady state creep had been attained, while DRX commenced before deformation became stationary for lower deformation temperatures. Flow stress and strain rate at the onset of DRX followed a common dependence in creep and in dynamic tests at all the temperatures investigated. The results can be understood in terms of recovery controlled nucleation of DRX, as suggested in previous studies for dynamic tests. No lower limit for the critical strain rate to induce DRX was found in the present investigations or could be inferred from literature data of Pb. The relevance to polycrystal deformation and to the interpretation of steady state creep is discussed.