Evolution of interface in pulsed electrode deposited titanium diboride on copper and steel

Abstract

Pulsed electrode surfacing (PES) is a microwelding surfacing process for the successful deposition of ultrahard wear and erosion resistant ceramic coatings on metals. The present study investigates titanium diboride deposition on oxygen free high conductivity Cu. A thin and irregular coating with cracks was obtained on the Cu substrate, with the ceramic/metal interface distinct in TiB₂ deposited on Cu leading to decohesion at the interface. The present work has been compared with an earlier study on TiB₂ coatings deposited on 1018 steel using the PES technique. The difference in nature of the interfaces has been related to wettability, and the role of copper and iron as binders for TiB₂ ceramics has been addressed. Iron acts as an excellent binder for TiB₂, providing a crack free coating and a strong interface, whereas Cu is a poor binder, leading to a weak ceramic/metal interface.

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References

JOHNSON

R. N.

: Thin Solid Films, 1984, 118, 31–47.

JOHNSON

R. N.

: in ‘Elevated temperature science and technology I’, (ed. Dahotre

N. B.

et al.), 264–277; 1994, Warrendale, PA, TMS.

JOHNSON

R. N.

: in ‘Surface modification technologies II’, (ed. Sudarshan

T. S.

and Bhat

D. G.

), 189–213; 1988, Warrendale, PA, TMS.

BROWN

E. A.

, SHELDON

G. L.

, and BAYOUMI

A. E.

: Wear, 1990, 138, 137–151.

AGARWAL

and DAHOTRE

N. B.

: Surf. Coat. Technol., 1998, 106, 242–250.

DAHOTRE

N. B.

, McCAY

M. H.

, and McCAY

T. D.

: Mater. Manuf. Process., 1994, 9, 1–36.

SAMSONOV

G. V.

, VERKHOTUROV

A. D.

, SYCHEV

V. S.

, and BEZYKORNOV

A. I.

: Fiz. Khim. Mekh. Mater., 1971, 7, 3–6.

CUTLER

R. A.

: in ‘Engineering materials handbook: ceramic and glasses’, Vol. 4, 787–803; 1991, Materials Park, OH, ASM International.

‘Metals handbook’, Vol. 1, 145–213; 1978, Metals Park, OH, American Society for Metals.

10.

SAMSONOV

G. V.

and VINITSKII

I. M.

: in ‘Handbook of refractory compounds’; 1980, New York, NY, Plenum Data.

11.

KLOMP

J. T.

: in ‘Designing interfaces for technological appli-cations: ceramic—ceramic and ceramic—metal joining’, (ed. Petevers

S. D.

), 127–144; 1989, New York, NY, Elsevier Applied Science.

12.

‘Metals handbook’, Vol. 3, (ed. Baker

); 1992, Materials Park, OH, ASM International.

13.

RAGHUNATH

, BHAT

M. S.

, and ROHATGI

P. K.

: Seripta Metall ., 1995, 32, 577–582.

14.

AGARWAL

and DAHOTRE

N. B.

: Int. J. Refract. Met. Hard Mater., to be published.

15.

RAMQUIST

: Int. J. Powder Metall., 1965, 4, 1–4.

16.

OGWU

A. A.

and DAVIES

T. J.

: Mater. Sci. Techrtol., 1993, 9, 213–217.

17.

DEMPSEY

: Philos. Mag., 1963, 3, 285.

18.

BREWER

: in ‘Electronic structure and alloy chemistry of transition elements’, (ed. Beck

), 221; 1963, New York, NY, Interscience.

19.

FRIEDEL

: in The physics of metals’, (ed. Ziman

J. M.

); 1969, Cambridge, Cambridge University Press.

20.

HAGG

: Z. Phys. Chem., 1969, B6, 221.

21.

TANAKA

, MORIMOTO

, and HOIVIMA

: Nippon Steel Tech. Rep., 1988, 37, 36.