Conventional transient liquid phase (TLP) bonds between the structural intermetallic compound NiAl and nickel base superalloys suffer from the formation, during bonding, of undesired stable second phases. The present paper investigates the extent to which this problem can be overcome by the use of a wide gap TLP bonding process, employing composite interlayers. The paper considers TLP bonding of single crystal NiAl–Hf to a polycrystalline superalloy Martin-Marietta (MM) 247 by means of an NiAl–Cu composite preform. The paper contrasts the relative influence of the TLP process and post-bond heat treatment on joint microstructure.
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