Modelling of the wide gap transient liquid phase (TLP) bonding of a Ti–48 at.-%Al–2 at.-%Cr–2 at.-%Nb (48–2–2) alloy with 48–2–2+Cu composite interlayers is examined. The role of the 48–2–2 powder particles in the composite interlayers during the isothermal solidification process was studied. This work was based on a high apparent diffusion coefficient of Cu in the multiphase γTiAl/α2 Ti3Al 48–2–2 alloy, combined with a low Cu solubility in 48–2–2. The redistribution, during bonding and post-bond heat treatment, of the Cu placed into the original composite interlayer is discussed. The model is used to account for the observed behaviour of 48–2– 2+Cu composite interlayer bonds.
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