Abstract
The stress induced martensitic transformation and the relationship between it and the nucleation and propagation of cracks in the Cu-Ni-Al shape memory alloy were investigated through in situ tensile tests by SEM and TEM. The results indicated that the stress concentration ahead of the crack tip could induce formation of stacking faults and different types of martensites. Transmission electron microscope observations showed that the martensites could transform from one type to another type and even reversely to parent during loading. The microcracks nucleated along the martensite/parent interface and intersections between two martensites. When the crack propagated a certain distance, the stress concentration ahead of the crack tip was large enough to result in formation of slip bands, in this condition the microcrack nucleated along slip bands more easily.
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