Influence of alloying elements on thermal conductivity and high temperature strength of copper based alloys

Abstract

The effects of alloying elements and annealing temperature on thermal conductivity and softening behaviour of Cu – 0·1Ag – xP–yMg and Cu – xSn – yTe alloys (all compositions are in wt-%) have been investigated. The Cu – 0·1Ag – xP–yMg alloys, in spite of greater amounts of P and Mg, had a higher electrical conductivity and a higher softening temperature than those of a Cu – 0·1Ag – 0·031P alloy. A Cu – 0·032Sn – 0·023Te alloy had the same levels of electrical conductivity and softening temperature as those of Cu – 0·040Sn. The conductivity and softening temperature of the Cu – 0·032Sn – 0·023Te alloy are comparable with those of the Cu – 0·1Ag – 0·013P alloy currently used for continuous casting mould materials.