Abstract
Investigations have been carried out on the effect of moisture in the reaction atmosphere (air at room temperature) on the oxidation rate of copper. Water vapour pressures of 2·6–16·6 torr (0·35–2·21 kNm−2) progressively increased the oxidation rate compared with that in dry air, and the limiting thickness at 16·6 torr (2·21 kNm−2) was increased almost threefold. This behaviour is attributed to structural abnormality produced within the oxide layer. The mechanism of oxidation at room temperature has been discussed in the light of the Mott–Cabrera theory supplemented by the concept of prohibitive activation energy.
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