Abstract
The proportions of CuO and Cu2O in films formed on copper and copper-manganese alloys in oxygen at temperatures of 150–400°c (600°c for higher Mn alloys) were estimated by coulometric reduction. Only Cu2O was observed at 150°c. The proportion of CuO increased as the temperature was raised, reaching 82% for copper at 300°c and somewhat lower values for the alloys containing Mn. At temperatures of 350–400°c, the proportion of CuO declined. The oxide remained adherent above 400°c only for alloys with 20% and 40% Mn. From 400° to 600°c the proportion of CuO increased for the 20% alloy but neither CuO nor Cu2O was found on the 40% alloy.
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