Abstract
This study investigates the residual bond behavior of thermally activated Fe-SMA/concrete interfaces through 39 groups of 117 single-shear specimens, considering adhesive type, adhesive thickness, bond length, heating temperature, thermal cycles, and substrate strength. Results show that high-temperature-resistant epoxy adhesives retained acceptable bond capacity after short-term exposure up to 200°C, and failure in concrete specimens was governed mainly by surface concrete spalling rather than adhesive failure. The interfacial ultimate load increased with adhesive thickness, bond length, and substrate strength, but decreased with increasing adhesive elastic modulus and heating temperature. Within the tested range, a 1 mm adhesive thickness, a low-modulus heat-resistant adhesive, and a 150 mm bond length are recommended for practical use. Among the candidate constitutive models, the Nakaba model best described the test results, and a temperature-dependent parameterization was established for the investigated range.
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