Transient Liquid Phase Diffusion Bonding of Steel Sandwich Panels under Small Plastic Deformation: Lab Experiment,Modeling,and Application

Abstract

Plastic deformation was newly introduced in transient liquid phase (TLP) diffusion bonding of steel sandwich panels. The effect of plastic deformation on bonding strength was investigated through lab experiments. It was assumed that three factors, including newly generated metal surface area, deformation heat and lattice distortion all contribute to the acceleration of interface atoms diffusion and increase of diffusion coefficients. A numerical model of isothermal solidification time was developed for TLP bonding process under plastic deformation and applied to carbon steel sandwich panels bonding with copper interlayer. A reasonable isothermal solidification time was obtained when an effective diffusion coefficient was used. Based on lab experiments, the effects of plastic deformation on interlayer film thickness and isothermal solidification time were studied through theoretical calculation with the new model. The evolution of interlayer film thickness indicates a good agreement between the calculation and experimental measurement. The results show that the isothermal solidification time is obviously reduced due to the effect of plastic deformation. Furthermore, a new steel sandwich cooling panel for heat exchanger was fabricated by TLP diffusion bonding under 13.1% plastic deformation. The test results suggest that a steel sandwich panel of inequidistant fin structure can provide enhanced heat transfer efficiency.

Keywords

sandwich panel transient liquid phase diffusion bonding isothermal solidification plastic deformation modeling heat transfer performance.

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