In this work, the fracture problem of an orthotropic functionally graded strip containing an internal crack parallel to its surfaces subjected to thermal shocks is examined. To eliminate the paradox of infinite heat propagation speed and take the microstructural interactions of thermal energy carriers into account, the non-Fourier, dual-phase-lag theory is employed to investigate the transient heat conduction and the associated thermal stresses response. By utilizing Laplace transform and Fourier transform, the thermoelastic problems are finally reduced to the Cauchy-type singular integral equations, which are solved by the Lobatto–Chebyshev technique numerically. The temperature field and thermal stress intensity factors are evaluated by the numerical inversion of Laplace transform to illustrate the effects of two thermal lags and nonhomogeneous parameters. The results show the fracture risks accompanied by the dual-phase-lag heat conduction can be higher than the classical analysis and it would be more conservative to consider non-Fourier effects in designing the orthotropic functionally graded materials.
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