Low residual vibration method at the end of picking arm based on fifth-order motion curve planning

Abstract

Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. However, the discontinuous acceleration of the linear motor in high-velocity motion deteriorates the stability of pick-up arm, leads to large residual vibration and long settling time during chips patch, deteriorating the precision and productivity of precision packaging equipment. To address these challenges, this study proposes an innovative super S-curve with continuous acceleration profile based on Hermite interpolation to reduce the induced vibration of system. The equivalent jerk strategy is innovatively introduced to effectively relieve the computational burden of higher order polynomials. Then, the dynamics model of motion system is established, and the vibration response results are calculated and simulated to show the superior of the proposed motion profiles. Finally, the vibrations of proposed motion profile are measured by experiments and compared with other profiles. The results validate the proposed motion profile can significantly reduce the residual vibration by 24.1%, and can reduce the settling time by more than 7.1%. The proposed method can significantly obtain lower residual vibration, balancing both motion smoothness and computational complexity.