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Abstract

This article proposes the design of several microelectromechanical amplification devices formed of many identical microunits that are connected in a serial–parallel configuration, each being individually actuated and amplifying its own input motion. The microdevices realize the border-crossing from the micro-to the meso-scale displacement domain as they combine the micron-level individual inputs into millimeter-range output levels. The base structural unit is a flexure-based compliant device that is capable of transforming the input from a thermal actuator into an amplified displacement, about a direction perpendicular to the input one. The base unit is designed based on performance criteria, such as displacement amplification, input stiffness and output stiffness by utilizing finite element simulation, and an algorithm based on closed-form compliance equations of the incorporated flexure hinges. The microelectromechanical amplification device is monitored by means of embedded capacitive displacement sensors for the input port. The feasibility of the device design was verified through a numerical simulation and some initial experimental results are presented.

Keywords

microscale amplification device capacitive sensing thermal actuator force sensing beam adhesion

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Design,Modeling,and Initial Experiments on Microscale Amplification Device

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