Abstract
A series of hybrid materials based on the diglycidyl ether of bisphenol-A (DGEBA) and 3-glycidoxypropyltrimethoxysilane(GPTMS) were prepared via a modified sol-gel process. The curing process of hybrid materials was analyzed with an advanced rheometric expansion system (ARES) and differential scanning calorimetry (DSC). Dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA) were carried out to evaluate the thermal properties of the resulted epoxy hybrids. Copper clad laminates were also prepared by a traditional hot-press moulding procedure with the hybrid varnish, which showed an excellent heat-resistant performance This kind of hybrid material may be suitable for electronic applications due to their excellent high temperature reliability and stability.