Abstract
Polyamideimide resins were prepared using three monomeric reactants: 5-norbornene-2,3'dicarboxylic anhydride (NA), 4-aminobenzoic acid, and 3,4'-oxydianiline (3,4'-ODA). The characteristics of the resins were analyzed by FTIR and elemental analysis. The PAI / Copper composites were prepared at 320°C and a pressure of 30Kg/cm2 (2.9Mpa). The heat resistance, chemical resistance, dielectric constant and dissipation factor were studied. The experimental results show that the peel strength of the composites with no coupling agent was 1.69Kgf/cm (1657N/m) and with 0.6% LICA97 coupling agent was 2.27Kgf/cm (2225N/m) After 24h at 300°C, the dielectric constants of PAI.1 (0.6% LICA97) were 2.46 and 2.47 (1MHz), and their dissipation factors were 0.0101 and 0.0110. After immersian in 10% H2SO4 solution, the peel strength retentions of the laminates were greater than 90%.