Abstract
Efficient cooling of heat sinks is essential for maintaining the performance and reliability of electronic devices, as it ensures effective heat dissipation and prevents overheating. A 3D CFD model, validated against experimental data, was used to investigate the thermal and hydraulic performance of four pin-fin heat sink configurations: solid, hollow, solid perforated, and hollow perforated fins. The study evaluated heat transfer rates and pressure drops for each design. The results show that hollow fins improve thermal response due to their lower thermal mass and faster heat conduction, while perforated fins reduce pressure drop. The hollow perforated configuration achieved the lowest fin temperatures, a 19.3% reduction in pressure drop, and the highest material savings of 63%, providing the optimal balance of thermal efficiency, hydraulic performance, and material economy. These findings provide practical guidance for designing high-performance, lightweight heat sinks.
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