Monocrystalline silicon, as a typical hard and brittle material, is prone to subsurface damage during nanomachining, which affects the subsequent performance of processed workpieces. By adjusting cutting parameters, subsurface damage and surface quality during the machining process can be controlled and improved. Therefore, this article explored the formation mechanism of sub-surface damage in monocrystalline silicon during nanocutting process through molecular dynamics(MD) simulation, and systematically studied the effects of four processing parameters, namely cutting crystal plane, cutting speed, tool rake angle, and relative tool sharpness, on the depth of sub-surface damage and surface roughness. The results indicated that high hydrostatic stress and high temperature during the cutting process promote the amorphous phase transition of the workpiece atoms, resulting in subsurface damage. Changes in cutting parameters can significantly affect subsurface damage and surface roughness. By optimizing cutting parameters, subsurface damage and surface roughness can be effectively controlled and improved.
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