Micro-vibration seriously affects the precision and stability of precision mechanical systems. Aiming at the micro-vibration existing in the semiconductor package positioning system, this paper first designed an active-passive integrated actuator (APIA) based on piezo-stack array, which compensated the mechanical error through the piezo-stack array to improve its positioning accuracy. Based on the APIA, a 6-PUU parallel micro-vibration suppression platform (MVSP) was designed, in which the two APIAs were combined into one and installed on the lower platform along the tangential distribution of the circle, and then the kinematic model of the platform was established. Finally, the PID control algorithm was used to conduct vibration isolation experiments on the MVSP. The experimental results showed that the MVSP had good vibration isolation performance for micro-vibration, the vibration isolation frequency band was above 5 Hz, and the attenuation of micro-vibration signals was between 18% and 64%.
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