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Abstract

In this study, the mechanical property of copper microwire, a widely used material in our daily life, is investigated by subjecting it to in situ scanning electron microscope twisting based on a self-developed nanorobotic manipulation system. First, copper microwire is assembled on the nanorobotic system inside the scanning electron microscope, and then twisted clockwise and anticlockwise continuously from 0° to 360° until fracture. After that, the mechanical properties of elastic modulus, microhardness, yield stress, and the strain hardening exponent of the twisted sample are investigated by nanoindentation. The change in elastic modulus and indention hardness showed strong indentation size effects, because a large number of geometrically necessary dislocations were generated around the indenter. In addition, the fracture analysis indicated that the smaller the scale of the material, the more sensitive it was to surface cracks or defects. Ductile fracture features of the twisted sample appear due to the nucleation, growth, and coalescence of the microvoids.

Keywords

Nanorobotic manipulation system scale effect micromechanics in situ scanning electron microscope twisting nanoindentation

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Scale effect investigation of copper microwire's mechanical properties after in situ scanning electron microscope twisting

Abstract

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