Abstract
Poly(ether-ketone)/fly ash (FA) composites reinforced with 0-30 wt% FA were fabricated using ball milling followed by hot compaction. The composites were investigated for mechanical and viscoelastic properties. Scanning electron microscopy revealed excellent dispersion and good adhesion of FA particles with the matrix. The addition of FA increased the microhardness by 70% and the storage modulus (below glass transition) by 75%. The reinforcing efficiency was better above the glass transition, which increased to around 177% at 250°C. This research indicates that the FA can be used as an alternative reinforcement of costly ceramic powder for the electronic packaging substrate or printed circuit board applications.
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