Structure and properties of thermoplastic polyimide based on 4′,4′—(oxybis (methylene)) bis ([1.1′- bipheny]3-amine) diamine

Abstract

In this work, a new diamine was designed by connecting flexible structures such as ether bond and aliphatic carbon chain between benzene rings, and was synthesized and purified through simple reactions such as Suzuki reaction. Finally, a series of polyimide (PI) films were synthesized by copolymerization with 4.4`-diaminodiphenyl ether (ODA)\pyromellitic dianhydride (PMDA) in different proportions. We prepared polyimide films with new monomer copolymerization ratios of 1% (PI-1), 5% (PI-2), 10% (PI-3), and 20% (PI-4). The polyimide films showed excellent glass transition temperatures, which were attributed to their unique bent architectures. The mechanical and thermal properties of the thermosets were studied using tensile testing, static thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). As the results, the films exhibited the optimal glass transition temperatures (317.56°C–381.91°C), and the component with the highest copolymerization ratio has a 15% decrease in glass transition temperature compared to the component without copolymerization. Moreover, PI-1-PI-4 showed good heat resistance in the N2 atmosphere. The temperatures corresponding to a 5% heat loss in the films (T5%) were 458.12 °C–548.75°C, respectively.