Reactive polyimide (PI) containing phenolic hydroxyl groups was prepared by the polymerization of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane and mixed thiodiphthalic anhydride. A series of epoxy resin composites were obtained by adding reactive PI to N,N,N′,N′-tetraglycidyl-4,4′-diamino-diphenylmethane (TGDDM) epoxy resin in different proportions. The effect of PI content on curing behavior, thermal properties, and mechanical properties was carefully investigated. Even a small amount of PI addition improved the mechanical properties and heat resistance of the epoxy resin, particularly the fracture toughness. Among them, epoxy resin composites EP-PI-1.5 with the addition of 1.5 wt% PI showed the best mechanical properties, whose impact strength, fracture toughness, and tensile strength were increased by 114%, 59%, and 34%, respectively. The phase morphology was also investigated to illustrate the fracture mechanism by scanning electron microscope (SEM) characterization.
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