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Abstract

In order to further improve both processability of imide oligomers containing pendent or/and terminal phenylethynyl groups and their cured T _g values without sacrificing mechanical properties, isomeric dianhydrides, 2,2',3,3'-biphenyltetracarboxylic dianhydride (3,3'-BPDA) or 2,3',3,4'-biphenyl tetracarboxylic dianhydride (3,4'-BPDA), were introduced into main chain. The rigid and bent structure of the isomeric BPDAs can provide a good combination of melt flow while maintaining a high T _g. Phenylethynyl containing oligoimides were prepared from the reaction of isomeric dianhydrides (3,3'-BPDA, 3,4'-BPDA and 4,4'-BPDA), 4,4'-oxydianiline (4,4'-ODA), 3,5-diamino-4'-phenylethynyl benzophenone (DPEB) and 4-phenylethynylphthalic anhydride (4-PEPA) or phthalic anhydride (PA) at an approximate number average molecular weight of 2500 and 5000 g mol^-1. The imide oligomers from 3,3'-BPDA and 3,4'-BPDA exhibited good processability. The 3,3'-BPDA-based imide oligomers exhibited slightly lower melt viscosity and the cured resins exhibited similar T _g values compared with those from 3,4'-BPDA. OI-7 and OI-8 each with a molecular weight of 2500 g mol^-1 had lower melt viscosities of 25 Pa s (342 °C) and 178 Pa s (344 °C) and higher cured T _g at 367 °C and 365 °C. The cured films from OI-7, OI-8 showed good tensile properties and the elongations at break were around 10%. The neat resins from OI-7 and OI-8 had higher compressive strengths of 200 and 190 MPa. G827/OI-7 and G827/OI-8 exhibited comparable mechanical properities: flexural strengths of 1714 and 1826 MPa, flexural modulus of 130 and 124 GPa, and interlayer shear strengths of 95 and 101 MPa, respectively.

Keywords

Isomeric imide oligomers biphenyltetracarboxylic dianhydride phenylethynyl group

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Thermal and Mechanical Properties of Phenylethynyl-Containing Imide Oligomers Based on Isomeric Biphenyltetracarboxylic Dianhydrides

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