Sage Journals: Discover world-class research

Abstract

The dielectric properties, dielectric relaxation behavior, electric conduction and kinetic characteristics of fluorine-containing polysiloxane-imide were investigated. The fluorine-containing polyimide [6FDA + p-PDA] has a low dielectric constant of 3.04, compared to normal polyimides such as Upilex-S [BPDA + p-PDA] with a dielectric constant of 3.47, due to the addition of perfluoroalkyl groups into the polymer backbone, while fluorine-containing polysiloxane-imide (6FDA + siloxane) has the lowest dielectric constant of 2.43, which is less than 2.5. The introduction of siloxane groups on the fluoric polyimides provides the possibility of obtaining high-performance polyimides with ultralow dielectric constants. The dielectric relaxation spectra suggest that the fluorine-containing polysiloxane-imide (6FDA + siloxane) has a phase separation structure. As frequency increases, the a relaxation strengths decrease and the;3 relaxation strengths hardly change. The conduction study indicates that the / peak corresponds to the /3 dipolar relaxation whereas the a one is due to the conductive effects in the bulk and the a dipolar relaxation. The activation energy of the a transition decreases with increasing frequency, while the activation energy of the /3 transition does not vary with frequency

Keywords

Fluorine-containing polysiloxane-imide ultralow dielectric constant dielectric relaxation behavior electric conduction and kinetic characteristics

Get full access to this article

View all access options for this article.

References

[1] Chilton J A and Goosy M T 1995 Special Polymers jor Electronics and Optoelectronics (London: Chapman and Hall) p 315-315

[2] Mahon W H 1968 Plastics Insulations ed P Bruins (New York: Wiley-Interscience) p 141-141

[3] Joel F R 1999 Polymer Science and Technology (New Delhi: Prentice-Hall) ch 10, p 353-353

[4] Gowrikar V R , Viswanathan N V and Sreedhar J 1988 Polymer Science (New Delhi: Wiley) p 227-227

[5] Negi Y S , Suzuki Y-I , Kawamura I , Kakimoto M-A and Imai Y 1998 High Perform. Polym. 10 45-45

[6] St Clair A K , St Clair T L , Slemp W F and Ezzell K S 1985 NASA Technical Memorando 87 650-650

[7] St Clair A K and St Clair T L 1984 Polvimides vol 2, ed K L Mittal (New York: Plenum) p 997-997

[8] St Clair A K , Stoakley D M and Emerson B R 1994 NASA Technical Brief February 58-58

[9] Hergenrother P and Jensen B J 1994 NASA Technical Briej February 56-56

10.

[10] Baumgartner C E and Scott L R 1995 J. Adhesion Sci. Technol. 9 789-789

11.

[11] St Clair T L , Whitley K S and Emerson B R 1994 NASA Technical Brief February 59-59

12.

[12] Rothman L B 1980 J. Electrochem. Soc. 127 2216-2216

13.

[13] Jensen R J and Lai J H 1989 Polymers for Electronic Applications ed J H Lai (Boca Raton, FL: Chemical Rubber Company Press) p 31-31

14.

[14] Soane D S and Martynenko Z 1989 Polymers for Microelectronics. Fundamentals and Applications (Ams- terdam: Elsevier) p 153-153

15.

[15] Pogge H B 1996 Electronic Materials Chemistry (New York: Dekker) p 439-439

16.

[16] Takeda S , Yusa M and Miyadera Y 1991 Polym. Preprints 40 818-818

17.

[17] Satou H and Makino D 1993

Polyimides for electronic applications

Polymers for Electronic and Photonic Application ed C P Wong (New York: Academic)

18.

[18] Kapton® Polyimide Film Summary of Properties 1985 Du Pont Product Brochure # E-72087 (1/1985)

19.

[19] Upilex®-S

Ube Ultra-High Heat-Resistant Polyimide Film Summary of Properties

1996 Ube Inidustries, Ltd (Tokyo) Product Brochure 1996

20.

[20] Ukishima S , lijima M , Sato M , Takahashi Y and Fukada E 1997 Thin Solid Films 308 475-475

21.

[21] Hougham G , Tesoro G and Shaw J 1994 Macromolecules 27 3462-3462

22.

[22] Hougham G , Tesoro G and Viehbeck A 1996 Macromolecules 29 3453-3453

23.

[23] Hougham G , Tesoro G , Viehbeck A and Chapple-Sokol J D 1994 Macromolecules 27 5964-5964

24.

[24] Maruo Y Y , Andoh Y and Sasaki S 1993 J. Vac. Sci. Technol. A 11 2590-2590

25.

[25] Auman B C , Higley D P , Scherer K V Jr , McCord E F and Shaw W H Jr 1995 Polymer 36 651-651

26.

[26] Tsai M H and Whang W T 2001 Polymer 42 4197-4197

27.

[27] Vora R H , Wang H M and Chung T-S 2001 Polyimides and Other High Temperature Polymers vol 1, ed K L Mittal (New York: VSP International Science) p 33-33

28.

[28] Hedrick J L , Cha H J , Miller R D , Yoon D Y , Brown H R , Srinivasan S , Di Pietro R , Cook R F , Hummel J P , Klaus D P , Liniger E G and Simonyi E E 1997 Macromolecules 30 8512-8512

29.

[29] Chen W C , Lin S C , Dai B T and Tsai M S 1999 J Electrochem. Soc. 146 3004-3004

30.

[30] Chen W C and Yen C T 1999 J. Polvm. Res. 6 197-197

31.

[31] Wang S , Ahmad Z and Mark J E 1993 Polym. Bull. 31 323-323

32.

[32] Morikawa A , Iyoku Y , Kakimoto M and Irnai Y 1992 J Mater Chem. 2 679-679

33.

[33] Mascia L and Kioul A 1995 Polymer 36 3649-3649

34.

[34] Srinivasan S A , Hedrick L J , Miller R D and Di Pietro R 1997 Polymer 38 3129-3129

35.

[35] Morikawa A , Lyoku Y , Kakimoto M and Imai Y 1992 Polym. J 24 107-107

36.

[36] Ahmad Z , Sarwar M I and Mark J E 1997 J Mater Chem. 7 259-259

37.

[37] Morikawa A , Yamaguchi H , Kakimoto M and Imai Y 1994 Chem. Mater 6 913-913

38.

[38] Hedrick J L , Cha H J , Miller R D , Yoon D Y , Brown H R , Srinivasan S , Di Pietro R , Cook R F , Hummel J P , Klaus D P , Liniger E G and Simonyi E E 1997 Macromolecules 30 8512-8512

39.

[39] Schrotter J C , Smaihi M and Guizard C 1996 J Appl. Polym. Sci. 61 2137-2137

40.

[40] Sysel P , Pulec R and Maryska M 1997 Polym. J 7 607-607

41.

[41] Kioul A and Mascia L 1994 J Non-Cryst. Solids 175 169-169

42.

[42] Nobuyuki F , Yasuharu Y and Yoshiharu K 1996 High Perform. Polym. 8 617-617

43.

[43] Pogge H B 1996 Electronic Materials Chemistry (New York: Dekker) ch 10

44.

[44] Van Krevelen D W 1990 Properties of Polymers (New York: Elsevier) ch 6

45.

[45] Runt J P and Fitzerald J J 1997 Dielectric Spectroscopy of Polymer Materials (Washington, DC: ASC)

46.

[46] Bernable A G , Calleja R D , Bello A and Perez E 2001 Polymer 42 6793-6793

Dielectric Properties of Fluorine-Containing Polymethylsiloxane-Imide Films

Abstract

Keywords

Get full access to this article

References