The thermomechanical behavior of a thermoplastic composite laminate during the tape placement process has been studied. Stresses induced by the compaction roller are predicted using a finite element method. These stresses control the compaction and bonding behavior of the laminate. In the analysis, the tape placement process is considered as a quasi-steady state rolling contact problem. The effect of temperature on creep compliance is included by treating the composite as a thermorheologicaliy simple material. Thermal expansion coefficients are allowed to be temperature dependent. The effect of friction at the contact surface is also taken into account.
The numerical results show how the process parameters (e.g., roller velocity, roller pressure, heat input) are related to temperature and stress distributions within the composite. These relationships can be used to predict the bonding behavior of the laminate.
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