The effects of molding and remolding temperatures on the Mode-I fracture toughness of APC-2 composite have been investigated. The morphology of the PEEK matrix in remolded plaques has been examined by thermal analysis and by scanning elec tron microscopy on etched surfaces. It is suggested that two recrystallization mechanisms compete during remolding at low melt temperatures: the annealing mechanism and a self- seeding crystal growth. The former embrittles the PEEK matrix, reducing the toughness of APC-2 composite.
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