Abstract
Dielectric Analysis is routinely used for monitoring the cure of thermosetting resins. Implantable, disposable sensors allow measurements of the curing process to be made in various locations throughout a part. Permanent, reusable sensors flush mounted in the mold allow the measurements to be made automatically during each molding cycle. This paper discusses process development, QA/QC, and production control in the polyester SMC/BMC industry. The curing rate through the cross-section of SMC parts of thicknesses up to 3/4 of an inch is examined. The effect of aging temperature on the reactivity of BMC demonstrates the use of Dielectric Analysis as a QA/QC test. Finally, it is shown that overall cycle times can be reduced by real time identification of the part-to-part variability in cure times during production molding. This allows closed-loop feedback to the press controller as to the proper time to demold each part.
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