Abstract
Curing reaction of a bismaleimide resin was investigated by dynamic differential scanning calorimetry at different heating rates. Activation energy was determined to be 91.861 kJ/mol on average by the Kissinger method and the Ozawa method. A piecewise fitting model was developed to describe the curing kinetic process. The piecewise model fitting results indicated a shift in the kinetic reaction mechanism from the Kamal model within the degree of cure range
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