Polyhedral oligomeric silsesquioxane (POSS) nanocrosslinker namely octaaminophenyl silsesquioxane reinforced with 1,1-bis(3-methyl-4-glycidyloxyphenyl)cyclohexane (diepoxide) modified diglycidyl ether of bisphenol-A (DGEBA) and tetraglycidyl diamino diphenyl methane (TGDDM) epoxy resins and cured with 4,4′-diaminodiphenylmethane (DDM). The chemical reactions that occurred between epoxy resins and DDM with POSS were confirmed by Fourier transform infrared spectroscopy. POSS-reinforced hybrid diepoxide-epoxy resin nanocomposites were characterised for their thermal, electrical and morphological properties. Tg and heat distortion temperature of hybrid epoxy increases with increased incorporation of POSS. The data obtained from thermal studies indicated that the incorporation of nano-POSS into diepoxide-modified hybrid systems possess improved thermal stability. Dielectric properties decreased with increasing percentage of POSS in both systems. The nanolevel dispersion of octaaminophenyl silsesquioxane (POSS) was confirmed by X-ray diffraction analysis and transmission electron microscope studies.
PanQChenXFanX. Organic-inorganic hybrid bent-core liquid crystals with cubic silsesquioxane cores. J Mater Chem2008; 18: 3481–3488.
2.
GojnyFHWichmannMHGKopkeU. Carbon nanotube-reinforced epoxy composites: Enhanced stiffness and fracture toughness at low nanotube content. Compos Sci Technol2004; 64: 2363–2371.
3.
KatihabwaAWangWJiangY. Multi-walled carbon nanotubes/silicone rubber nanocomposites prepared by high shear mechanical mixing. J Reinf Plast Compos2011; 30(12): 1007–1014.
4.
ParkYJLimaDHKimHJPark. UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers. Inter J Adhes Adhes2009; 29(7): 710–717.
5.
ZhangWPicuRCKoratkarN. The effect of carbon nanotube dimensions and dispersion on the fatigue behavior of epoxy nanocomposites. Nanotechnology2008; 19: 285709–285709.
GoffinALDuquesneERaquezJM. From polyester grafting onto POSS nanocage by ring-opening polymerization to high performance polyester/POSS nanocomposites. J Mater Chem2010; 20: 9415–9422.
8.
MadboulySAOtaigbeJUNandaAK. Rheological behavior of POSS/polyurethane–urea nanocomposite films prepared by homogeneous solution polymerization in aqueous dispersions. Macromolecules2007; 40: 4982–4991.
9.
JothibasuSPremkumarSAlagarM. Synthesis and characterization of a POSS-maleimide precursor for hybrid nanocomposites. High Perform Polym2007; 20(1): 67–85.
10.
NagendiranSAlagarMHamertonI. Octasilsesquioxane-reinforced DGEBA and TGDDM epoxy nanocomposites: Characterization of thermal, dielectric and morphological properties. Acta Mater2010; 58: 3345–3356.
11.
DevarajuSVengatesanMRAlagarM. Studies on thermal and dielectric properties of ether linked cyclohexyl diamine (ELCD)-based polyimide POSS nanocomposites (POSS-PI). High Perform Polym2011; 23(2): 99–111.
12.
VengatesanMRDevarajuSDinakaranK. Studies on thermal and dielectric properties of organo clay and octakis (dimethylsiloxypropylglycidylether) silsesquioxane filled polybenzoxazine hybrid nanocomposites. Polym Compos2011; 32: 1701–1711.
13.
ZhangZWangXXieJ. Using octa(aminpropyl) silsesquioxane as the curing agent for epoxy resin. J Reinf Plast Compos2007; 26(16): 1665–1670.
14.
ChenWYWangYZKuoSW. Thermal and dielectric properties and curing kinetics of nanomaterials formed from poss-epoxy and meta-phenylenediamine. Polymer2004; 45(20): 6897–6908.
15.
LiuHZhengSNieK. Morphology and thermomechanical properties of organic-inorganic hybrid composites involving epoxy resin and an incompletely condensed polyhedral oligomeric silsesquioxane. Macromolecules2005; 38: 5088–5097.
RashidESAAriffinKKooiCC. Preparation and properties of POSS/epoxy composites for electronic packaging applications. Mater Des2009; 30 (1): 1–8.
18.
SanariaMRGoddhani BalujaSPrashanaPH. Synthesis and characterization of 1,1′-bis(4-hydroxyphenyl)cyclohexane and 1,1′-bis(3-methyl-4-hydroxyphenyl)cyclohexane. J Polym Mater1998; 15: 45–49.
19.
NiYZhengSNieK. Morphology and thermal properties of inorganic-organic hybrids involving epoxy resin and polyhedral oligomeric silsesquioxanes. Polymer2004; 45(16): 5557–5568.
LiuHUhlherrABannisterMK. Quantitative structure-property relationships for composites: prediction of glass transition temperatures for epoxy resins. Polymer2004; 45: 2051–2060.
23.
GlodekTEBoydSEMcAninchIM. Properties and performance of fire resistanteco-composites using polyhedral oligomeric silsesquioxane (POSS) fire retardants. Compos Sci Technol2008; 68: 2994–3001.
24.
KimHUBangYHChoiSM. Morphology and mechanical properties of PET by incorporation of amine-polyhedral oligomeric silsesquioxane. Compos Sci Technol2008; 68: 2739–2747.
25.
LuTLiangGKouK. Review Synthesis and characterization of cage octa(cyclohexylsilsesquioxane). J Mater Sci2005; 40(18): 4721–4726.
LinSTHuangSK. Thermal degradation study of siloxane-DGEBA epoxy copolymers. Eur Polym J1997; 33(2): 365–373.
28.
MonteroBRamirezCRicoM. Effect of an epoxy octasilsesquioxane on the thermodegradation of an epoxy/amine system. Polym Int2010; 59: 112–118.
29.
ZhangCBabonneauFBonhommeC. Highly porous polyhedral silsesquioxane polymers: Synthesis and characterization. J Am Chem Soc1998; 120: 8380–8391.
30.
LeuCMReddyMWeiKH. Synthesis and dielectric properties of polyimide-chain-end tethered polyhedral oligomeric silsesquioxane nanocomposites. Chem Mater2003; 15: 2261–2265.
31.
RoyMNelsonJKMacCroneRK. Candidate mechanisms controlling the electrical characteristics of silica/XLPE nanodielectrics. J Mater Sci2007; 42: 3789–3799.
32.
HuangXXieLJiangP. Morphology studies and ac electrical property of low density polyethylene/octavinyl polyhedral oligomeric silsesquioxane composite dielectrics. Eur Polym J2009; 45: 2172–2183.
33.
PopielarzRChiangCKNozakiR. Dielectric properties of polymer/ferroelectric ceramic composites from 100 Hz to 10 GHz. Macromolecules2001; 34: 5910–5915.
