Abstract
Modified nanosilica was filled into stereolithography (SL) resin by means of mechanical and ultrasonic dispersion. While the concentration of SiO 2 was below 3 wt%, viscosity measurement showed that the nanoparticles were well dispersed in the resin. Then these modified photosensitive resins were applied to SL prototyping. The results of experiments indicated that, compared with the unmodified resin, the critical exposure of the modified resins increased and their penetration depth decreased. In addition, the mechanical properties of cured specimens increased, and glass transition temperature and the thermal stability of cured specimens were also improved.
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