In this work the repairing process of a completely cured epoxy-glass laminate was simulated. Repairing plaques were joined to the original material at different curing temperatures. After reparation, delamination, lap-shear and impact tests were carried out. Fiber bridging was observed. The optimum temperature for delamination was 70°C. Strength and modulus increased with the curing temperature. In the case of impact test, higher temperature favored the patch failure against the failure of the base material.
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