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Abstract

Octa(aminpropyl)silsesquioxane (NH₂CH₂CH₂CH₂)₈Si₈O₁₂ (POSS-NH₂), containing eight amine groups on the vertexes, was first used as the curing agent for epoxy resin diglycidyl ether of bisphenol A(DGEBA) in order to improve the overall performance of epoxy resins, such as mechanical properties, thermal resistance and dielectric properties. The disappearance of epoxy groups on the FT-IR spectra at the end of the curing process indicated that epoxy groups reacted with POSS to form a three-dimensional crosslinking network, and the epoxy resin was completely cured. Properties of the cured DGEBA/POSS nanocomposite containing 30wt% of POSS-NH₂ were studied. SEM images of the flexural fractures of epoxy/POSS system indicated that the inorganic-organic materials possessed excellent toughness. TGA analysis revealed that the cured network showed enhanced thermal stability with respect to the cured DGEBA/DDS system.

Keywords

polymer composites Polyhedral Oligomeric Silsesquioxane epoxy resin.

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Using Octa(aminpropyl)silsesquioxane as the Curing Agent for Epoxy Resin

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