Beryllium oxide (BeO)-filled epoxy composite was prepared and used as a thermal interface material (TIM) in light-emitting diode (LED) packages. The filler percentages influenced on changing thermal and optical behaviour of LED at various driving currents. An improvement of 14.36% in thermal conductivity was recorded from that of neat epoxy. The lowest total thermal resistance of 10.75 K/W (Rth) and rise in junction temperature (Tj) of 3.1°C were recorded at 100 mA driving current for 50 wt-% BeO-filled TIM attached LED followed by an improved optical output and lowered correlated colour temperature values (3466 K). Thermal imaging infra-red imaging analysis also supported the observation of reduced Tj and Rth values from transient analysis and indicated lower chip surface temperature (Ts) at all driving currents.
HalimaABAraoudZCanaleL, et al.Energy efficiency of a LED lighting system using a Peltier module thermal converter. Case Stud Therm Eng2022; 34: 101989.
2.
PoppeAFarkasGMolnárG, et al.Emerging standard for thermal testing of power LEDs and its possible implementation. In: Tenth International Conference on Solid State Lighting, San Diego, California, United States, 18 August 2010, pp.196–210: SPIE 7784, United States.
3.
FengC-PYangL-YYangJ, et al.Recent advances in polymer-based thermal interface materials for thermal management: a mini-review. Compo Comm2020; 22: 100528.
4.
ChungDDL. Performance of thermal interface materials. Small2022; 18: 2200693.
5.
GardeaFLagoudasDC. Characterization of electrical and thermal properties of carbon nanotube/epoxy composites. Compos Part B: Eng2014; 56: 611–620.
6.
KaleemullahMKhanSUKimJK. Effect of surfactant treatment on thermal stability and mechanical properties of CNT/polybenzoxazine nanocomposites. Compos Sci Tech2012; 72: 1968–1976.
7.
LiuJMouYHuangY, et al.Effects of bonding materials on optical-thermal performances and high-temperature reliability of high-power LED. Micromachines (Basel)2022; 13: 58.
8.
ZhouYWuSLongY, et al.Recent advances in thermal interface materials, ES. Mater Manuf2020; 7: 4–24.
9.
HongHKimJUTae-ilK. Effective assembly of nano-ceramic materials for high and anisotropic thermal conductivity in a polymer composite. Polymers2017; 9: 13.
10.
SuYShiQXieY, et al.Preparation and properties of BN/Si3N4/epoxy composites. J Macromole Sci Part B2021; 60: 461–471.
11.
ThuongNTLamNBSonPA, et al.Preparation and characterization of thermally conductive high impact polystyrene/AlN composite. Int J Poly Sci2024; 2024: 2723981.
12.
WuXJiangPZhouY, et al.Influence of alumina content and thermal treatment on the thermal conductivity of UPE/Al2O3 composite. J Appl Polym Sci2014; 131: 1–11.
13.
ZengXYaoYGongZ, et al.Ice-templated assembly strategy to construct 3D boron nitride nanosheet networks in polymer composites for thermal conductivity improvement. Small2015; 11: 6205–6213.
14.
GuJ-WZhangQZhangJ,et al.Studies on the preparation of polystyrene thermal conductivity composites. Polym Plast Technol Eng2010; 49: 1385–1389.
15.
AkishinGPTurnaevSKVaispapirVY, et al.Thermal conductivity of beryllium oxide ceramic. Refract Indust Ceram2009; 50: 465–468.
16.
NabihahMFShanmuganS. Structural parameter and TEM analysis of beryllium oxide nanoparticles synthesized by polyacrylamide gel route. Digest J Nanomater Biostruct2016; 11: 349–356.
17.
VelaniMNPatelRR. Effect of size and shape of nanofillers on electrostatic and thermal behavior of epoxy-based composites. Polym Polym Compos2021; 29: 978–988.
18.
NabihahMF. Experimental and Correlated Studies on Thermal Conductivity of Beryllium Oxide Particles Filled Polymer as Thermal Interface Material for Dynamic Heat Flow in LEDs Package. Master’s Thesis, 2019.
19.
PandaA. Effect of shape size and content on the effective thermal conductivity BeO filled polymer composites. B.Tech thesis, IIT Rourkela, May 2013.
20.
XiuTPTLiYJChenH, et al.Patent US9127116 B2. 30 Dec (2011).
21.
RenczMRSzékelyV. Measuring partial thermal resistances in a heat-flow path. IEEE Trans Compo Pack Tech2002; 25: 547–553.
22.
RenczM. New possibilities in the thermal evaluation, offered by transient testing. Microelectr J2003; 34: 171–177.
23.
RenczMPoppeAKollárE, et al.A procedure to correct the error in the structure function based thermal measuring methods. In: Twentieth annual IEEE semiconductor thermal measurement and management symposium (IEEE Cat. No. 04CH37545), San Jose, CA, USA, 11 March 2004, pp. 92–97
24.
T'JoenCParkYWangQ, et al.A review on polymer heat exchangers for HVAC&R applications. Inter J Refriger2009; 32: 763–779.
25.
HuMYuDWeiJ. Thermal conductivity determination of small polymer samples by differential scanning calorimetry. Poly Test2007; 26: 333–337.
26.
FuYXHeZXMoDC,et al.Thermal conductivity enhancement with different fillers for epoxy resin adhesives. Appl Therm Eng2014; 66: 493–498.
27.
NgoILByonC. Thermal conductivity of particle-filled polymers. Poly Sci Book Series2016: 554–565.
28.
LopesCMFelisbertiMI. Thermal conductivity of PET/(LDPE/AI) composites determined by MDSC. Poly Test2004; 23: 637–643.
29.
NayakSKMohantySNayakSK. Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application. SN Appl Sci2019; 1: 1–15.
30.
SarvarFWhalleyDConwayP. Proceedings of the 1st electronics systemintegration technology conference. In: Thermal interface materials – A review of the state of the art, Dresden, Germany, 5–7 September 2006, pp. 1292–1302.
31.
LinZLiuYRaghavanS, et al.Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation. ACS Appl Mater Interfaces2013; 5: 7633–7640.
32.
GustavssonMKarawackiEGustafssonSE. Thermal conductivity, thermal diffusivity, and specific heat of thin samples from transient measurements with hot disk sensors. Rev Scientific Instru1994; 65: 3856–3859.
33.
AgariYTanakaMNagaiS,et al.Thermal conductivity of a polymer composite filled with mixtures of particles. J Appl Poly Sci1987; 34: 1429–1437.
34.
Chauhan D SinghviNSinghR. Effect of the geometry of filler particles on the effective thermal conductivity of two-phase systems. Int J Mod Nonlinear Theory Appl2012; 1: 40–46.
35.
AnithambigaiPMutharasuDHuongLH, et al.Synthesis and thermal analysis of aluminum nitride filled epoxy composites and its effective application as thermal interface material for LED applications. J Mater Sci: Mater Electro2014; 25: 4814–4821.
36.
HuangXJiangPTanakaT. A review of dielectric polymer composites with high thermal conductivity. IEEE Electr Insul Magaz2011; 27: 8–16.
37.
SunGDongTLuoA, et al.High thermal performance ultraviolet (368 nm) AlGaN-based flip-chip LEDs with an optimized structure. Nanomaterials2024; 14: 267.
JongWH. Advanced Materials and Structural Engineering: Proceedings of the International Conference on Advanced Materials and Engineering Structural Technology (ICAMEST 2015), April 25–26 (2015) 3 Feb 2016 – Technology & Engineering – 996 pages, ISBN-1315683024, 9781315683027.
