In situ temperature measurement of a deforming interface with thermoelectricity

Abstract

Accurate temperature measurement is critical to understanding the thermomechanical conditions and microstructural evolution that materials experience during severe plastic deformation (SPD). Others have previously measured the interface between a non-deforming tool and metal workpiece using thermocouples, infrared measurement, and the thermoelectric principle. Measuring temperature within the deforming material itself, especially at a high-shear deforming interface, has proven to be extremely difficult, thus limiting the application of these measurements to fundamental SPD research. In this study, the thermoelectric principle is used to directly measure temperature at the interface between copper and nickel billets undergoing SPD. This is done by utilizing the deforming materials themselves as two halves of a thermocouple junction. The spatial resolution of this measurement is shown via microscopy to be less than 1 micron. Temperature changes are sensed almost instantly, with time delays on the order of the data logger frequency (0.01 seconds). Process variations that are both very brief (<0.05 seconds) and minute (<3°C) are able to be detected by this method.