The selection of encapsulants for specific applica tions requires careful evaluation of both resin properties and hardward requirements. The intent of this paper is to present some of the more important elements of this evaluation tech nique. Guidelines for selection of tests to determine the en capsulants properties, as well as evaluation of the test results, is included.
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References
1.
"Guidelines for Selection of Tests for Material Properties of Liquid Thermoset Encapsulating Compounds for Electronic and Microelectronic Encapsulation," ASTM F 635-80, ASTM Standards, Part 43, American Society for Testing and Materials, Philadelphia, PA19103 (1980).
2.
D.S. Lequin, R.D. Ezell, "Evaluation of Potting Compounds by Electrical Resistivity Techniques Using the Continuous Current Monitoring Device (CCMD)", NSWC Technical Report NOLTR 73-10, Naval Surface Weapons Center, Silver Spring, MD20910 (23 Feb 1973).
