A simplified three-dimensional mathematical model for electronic packaging cabinets was derived from physical laws. Tridimensionality resulted from the domain division in volume elements (VEs) with uniform properties, each with one temperature, and empirical and theoretical correlations allowed for modeling their energetic interaction, thus producing ordinary differential equations (ODEs) temperatures versus time system. The cabinet (2048 mm × 1974 mm × 850 mm) thermal response with one heat source was measured. Data set 1 with a 1.6-kW power source was used for model adjustment by solving an inverse problem of parameter estimation (IPPE) having the cabinet internal average air velocities as adjustment parameters. Data set 2 obtained with a 3-kW power source validated model results. The converged mesh had a total of 7500 VE. The steady-state solution took between 16 and 19 s of CPU time to reach convergence and less than 3 min to obtain the 6500-s cabinet dynamic response under variable loading conditions, in an Intel CORE i7 computer. After validation, the model was used to study the impact of heat source height on system thermal response. Fundamentally, a sharp minimum junction temperature Tjct,min = 98.5 °C was obtained in the system hot spot at an optimal heat source height, which was 25.7 °C less than the highest calculated value within the investigated range (0.1 m < zjct < 1.66 m) for the 1.6-kW power setting, which characterizes the novelty of the research, and is worth to be pursued, no matter how complex the actual cabinet design may be.
Alibakhshi-KenariMKhalilyMVirdeeBS, et al. Double-port slotted-antenna with multiple miniaturized radiators for wideband wireless communication systems and portable devices. Prog Electromagn Res C2019; 90: 1–13.
2.
Alibakhshi-KenariMVirdeeBSAliA, et al. Extended aperture miniature antenna based on CRLH metamaterials for wireless communication systems operating over UHF to C-band. Radio Sci2018; 53: 154–165.
3.
Alibakhshi-KenariMVirdeeBSAliA, et al. Miniaturized planar-patch antenna based on metamaterial L-shaped unit-cells for broadband portable microwave devices and multiband wireless communication systems. IET Microw Anten Propag2018; 12: 1080–1086.
4.
Alibakhshi-KenariMNaser-MoghadasiaMSadeghzadehRA, et al. Miniature CRLH-based ultra wideband antenna with gain enhancement for wireless communication applications. ICT Exp2016; 2: 75–79.
5.
Alibakhshi-KenariMNaser-MoghadasiMSadeghzadehR. The resonating MTM-based miniaturized antennas for wide-band RF-microwave systems. Microw Opt Technol Lett2015; 57: 2339–2344.
6.
Alibakhshi-KenariMNaser-MoghadasiM. Novel UWB miniaturized integrated antenna based on CRLH metamaterial transmission lines. Int J Electron Commun2015; 69: 1143–1149.
7.
Alibakhshi-KenariMVirdeeBSLimitiE. Compact single layer travelling-wave antenna design using metamaterial transmission-lines. Radio Sci2017; 52: 1510–1521.
8.
Alibakhshi-KenariMNaser-MoghadasiMSadeghzadehRA, et al. New compact antenna based on simplified CRLH-TL for UWB wireless communication systems. Int J RF Microw Comput Aid Eng2016; 26: 217–225.
9.
Alibakhshi-KenariMAndújarAAngueraJ. New compact printed leaky-wave antenna with beam steering. Microw Opt Technol Lett2016; 58: 215–217.
10.
Alibakhshi-KenariMNaser-MoghadasiMVirdeeBS, et al. Compact antenna based on a composite right/left-handed transmission line. Microw Opt Technol Lett2015; 57: 1785–1788.
11.
BoukniaMLZebiriCSayadD, et al. Theoretical study of the input impedance and electromagnetic field distribution of a dipole antenna printed on an electrical/magnetic uniaxial anisotropic substrate. Electronics2021; 10: 1050.
12.
BoukniaMLZebiriCSayadD, et al. Analysis of the combinatory effect of uniaxial electrical and magnetic anisotropy on the input impedance and mutual coupling of a printed dipole antenna. IEEE Access2021; 9: 84910–84921.
13.
Alibakhshi-KenariMVirdeeBSAïssaS, et al. Singular integral formulations for electrodynamic analysis of metamaterial-inspired antenna array. IEEE Anten Wirel Propag Lett2021; 20: 179–183.
14.
OrdonezJCVargasJVCHovsapianR. Modeling and simulation of the thermal and psychrometric transient response of all-electric ships, internal compartments and cabinets. Simul Trans Soc Model Simul Int2008; 84: 427–439.
15.
DilayEVargasJVCOrdonezJC, et al. The experimental validation of a transient power electronic building block (PEBB) mathematical model. Appl Therm Eng2013; 60: 411–422.
16.
VargasJVCSouzaJAHovsapianR, et al. Notional all-electric ship systems integration thermal simulation and visualization. Simul Trans Soc Model Simul Int2012; 88: 1116–1128.
17.
ShahjalalMLuHBaileyC. A review of the computer based simulation of electro-thermal design of power electronics devices. In: Proceedings of the 20th international workshop on thermal investigations of ICs and systems (THERMINIC 2014), Greenwich, 24–26 September 2014.
18.
QianCGheitaghyAMFanJ, et al. Thermal management on IGBT power electronic devices and modules. IEEE Access2018; 6: 12868–12884.
19.
NakayamaWSuzukiOHaraY. Thermal management of electronic and electrical devices in automobile environment. In: Proceedings of the 5th IEEE vehicle power and propulsion conference (VPPC’09), Dearborn, MI, 7–10 September 2009.
20.
AbebeRVakilGLo CalzoG, et al. FEA based thermal analysis of various topologies for integrated motor drives (IMD). In: Proceedings of the IECON 2015: 41st annual conference of the IEEE industrial electronics society, Yokohama, Japan, 9–12 November 2015.
21.
Bar-CohenAMaurerJJAltmanDH. Embedded cooling for wide bandgap power amplifiers: a review. J Electron Packag2019; 141: 040803.
22.
BreljeBJMartinsJRRA. Electric, hybrid, and turboelectric fixed-wing aircraft: a review of concepts, models, and design approaches. Prog Aerosp Sci2019: 104: 1–19.
23.
HalesAJiangX. A review of piezoelectric fans for low energy cooling of power electronics. Appl Energ2018; 215: 321–337.
24.
TangHTangYWanZ, et al. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling. Appl Energ2018; 223: 383–400.
25.
VargasJVCStanescuGFloreaR, et al. A numerical model to predict the thermal and psychrometric response of electronic packages. J Electron Packag2001; 123: 200–210.
26.
AlmgrenASBellJBRendlemanCA, et al. Low Mach number modeling of type Ia supernovae. I. Hydrodynamics. Astrophys J2006; 637: 922–936.
27.
MinkowyczWJSparrowEMSchneiderGE, et al. Chapter 17: handbook of numerical heat transfer. 2nd ed.New York: Wiley, 2006.
ASME Editorial Board. Journal of heat transfer editorial policy statement on numerical accuracy. J Heat Trans1994; 116: 797–798.
30.
KimJHSimonTWViskantaR. Journal of heat transfer policy on reporting uncertainties in experimental measurements and results. J Heat Trans1993; 115: 5–6.
31.
Van BelleG. Statistical rules of thumb. 2nd ed.New York: Wiley-Interscience, 2008.
32.
BejanA. Heat transfer. New York: Wiley, 1993.
33.
Lawrence Livermore National Laboratory. VisIt 1.11.1 manual. Livermore, CA: Lawrence Livermore National Laboratory, 2008.
34.
VassighiASachdevM. Thermal and power management of integrated circuits (integrated circuits and systems). New York: Springer, 2006.
35.
KhazakaRMendizabalLHenryD, et al. Survey of high-temperature reliability of power electronics packaging components. IEEE Trans Power Electr2015; 30: 2456–2464.
36.
ShapiroB. Creating compact models of complex electronic systems: an overview and suggested use of existing model reduction and experimental system identification tools. IEEE Trans Comp Package Technol2003; 26: 165–172.
37.
DilayEVargasJVCSouzaJA, et al. A volume element model (VEM) for energy systems engineering. Int J Energ Res2015; 39: 46–74.
38.
NieQJoshiY. Reduced order modeling of power electronics cabinet with double-sided cooling. In: Proceedings of the 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems, Orlando, FL, 28–31 May 2008.
