High-frequency-response, semiconductor, strain gages used in various combinations have been embedded in S-2 glass epoxy composite test plates during in-house fabrication using vacuum-assisted resin transfer molding in order to measure the transient strain and its rate during the impingement of the shock wave and subsequent interactions. To validate the techniques systematically, an in-house-developed, split-view time-resolved, stereo digital image correlation system has been used to compare static and time-dependent strain signals on a two-dimensional surface in a shock tube facility. Small size non-encapsulated solid-state gages were cumbersome to handle during the fabrication process, while encapsulated strain gages had very good spatial resolution and overall performance combined with some ease in handling during fabrication. The strain results indicate that embedding sensors is an accurate and inexpensive method to characterize composites under high-rate loading.
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