The use of poly(amide-imide)/CuO as a filler for the preparation of poly(vinyl pyrrolidone) nanocomposites: Thermal and morphological studies

Abstract

Poly(vinyl pyrrolidone)/poly(amide–imide)–CuO nanocomposites were prepared by adding of poly(amide–imide)–CuO nanocomposite as filler in a poly(vinyl pyrrolidone) matrix via ultrasonication method. First, the surface of CuO nanoparticles was modified with a bioactive coupling agent using the ultrasonic-assisted technique in order to obtain a homogeneous dispersion of CuO nanoparticles in the poly(amide–imide) matrix. Then, modified CuO nanoparticles were dispersed in the poly(amide–imide) matrix. The poly(amide–imide)–CuO nanocomposite was mixed with poly(vinyl pyrrolidone) and the obtained nanocomposites were investigated by Fourier transform infrared and X-ray diffraction spectroscopy techniques. The Fourier transform infrared results indicated interactions between the poly(amide–imide)–CuO nanocomposite and the poly(vinyl pyrrolidone) chain. Thermogravimetric analysis was used to investigate the thermal properties of poly(vinyl pyrrolidone) nanocomposites. Thermogravimetric analysis results illustrated that the thermal stability of poly(vinyl pyrrolidone) is enhanced by adding of nano-filler. The surface topography and morphology of the poly(amide–imide)–CuO nanocomposite and poly(vinyl pyrrolidone)/poly(amide–imide)–CuO nanocomposites were studied by atomic force microscopy, field emission scanning electron microscopy, and transmission electron microscopy techniques. The results showed that the nano-filler was homogeneously dispersed in the polymer matrix.

Keywords

CuO nanoparticles surface modification poly(amide–imide)poly(vinyl pyrrolidone) nanocomposite surface topography thermal stability

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