Teaching of integrated circuit engineering in New Zealand initially involved establishment of a Thick Film Hybrid Microelectronics Laboratory. Students now gain ‘hands-on’ experience using high quality equipment and processing standards which ensure commercially viable results, leading to increased confidence and satisfaction. Course structure is illustrated with typical projects.
Get full access to this article
View all access options for this article.
References
1.
EdwardL. N. M. and ByersD. J., ‘Hybrid microelectronics in New Zealand,’New Zealand Electronics Review, 7, pp. 13–14 (September 1973).
2.
EdwardL. N. M.‘New microelectronics laboratory’, New Zealand Electronics Review, 12, pp. 43–47 (August 1979).
3.
ZarnowD. F., ‘A new approach to thick film resistors’, ISHM Proceedings of the 1979 International Microelectronics Symposium, pp. 32–39 (November 13–15).
4.
CheriffF. J. and SalzerT. E.‘High reliability ultrasonic wire bonding,’ISHM International Microelectronic Symposium Proceedings, pp. 221–27Sheraton-Boston Hotel, (October 21–23, 1974).
5.
OttavianoA. V., ‘Repeatability in screen printing hybrid microcircuits’, ISHM 1969 Hybrid Microelectronics Symposium Proceedings, pp. 253–62 (September, 1969).
6.
KuoC. Y., ‘The contact resistance in thick film resistors,’ISHM 1969 Hybrid Microelectronics Symposium Proceedings, pp. 263–69 (September 1969).
7.
CreterP. G. and PetersD. E., ‘A new method for cleaning microelectronic substrates’, ISHM Proceedings of the 1977 International Microelectronics Symposium, Baltimore Hilton and Civic Centre, pp. 281–86 (October, 1977).
8.
EdwardL. N. M., “LINSIM, A linear electrical network simulation and optimisation program,”to be published.
