Computationally Efficient Fracture Analysis of Electronic Packages through Decomposition

Abstract

In the present paper we describe and demonstrate a computationally efficient technique for analyzing fracture mechanics problems in mixed linear-nonlinear systems. The technique combines the methodology of Rybicki and Kanninen for calculation of the energy release rate in fracture processes with a decomposition based analysis procedure recently proposed by Subbarayan and co-workers. The methodology will enable quick design decisions during the package development stages without significant loss of accuracy. The developed procedure is demonstrated on a hypothetical 5 × 5 array package. It is shown that on this representative package nearly 30% time savings (or a 150% speed-up) can be acheived in estimating the energy release rate at an accuracy loss of only 6.2%. Prior research has shown that the analysis time is nearly independent of package size, indicating unbounded speed-ups for larger package sizes.

Get full access to this article

View all access options for this article.

References

1. Deshpande, A. and Subbarayan, G. , 2000, “An Efficient Technique for Decomposed Analysis of Area Array Packages,” Journal of Electronic Paclaging, 122, 1, 13–19.

2. Ju, S.H. , Sandor, B.I. , Plesha, M.E. , 1996, “Life Predictions of Solder Joint by Damage and Fracture Mechanics,” Journal of Electronic Packaging,118, 193–200.

3. Lau, J.H. , Lee, S.-W.R. and Chang, C. , 2000, “Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board with Imperfect Underfill Encapsulants,” IEEE Transactions on Components and Packaging Technologies, 23, 2, 323–333

4. Liu, S. and Mai, Y. , 1995, “Behavior of Elastic Delaminated Plastic IC Packages Subjected to Encapsulated Cooling, Moisture Absorption and Wave Soldering,” IEEE Transactions on Components and Packaging Technologies—Part A, 18, 3, 634–645.

5. Liu, S. , Mai, Y. and Wu, T. , 1995, “Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity,” IEEE Transactions on Components and Packaging Technologies—Part A, 18, 3, 618–625.

6. Mercado, L. and Sarihan, V. , 2000, “Evaluation of Die Cracking in Flip-Chip PBGA Packages,” ITherm 2000 Conference.

7. Raju, I.S. , 1987, “Calculation of Strain-Energy Release Rates with Higher Order and Singular Finite Elements,” Engineering Fracture Mechanics, 28, 3, 251–274.

8. Rybicki, E. F. and Kanninen, M. F. , 1977, “A Finite Element Calculation ofStress Intensity Factors by a Modified Crack Closure Integral,” Engineering Fracture Mechanics, 9, 931–938.

9. Schittkowski, K. , 1985, “NLPQL: A Fortran Subroutine Solving Constrained Nonlinear Programming Problems,” Annals of Operations Research, 1985/6, 5, 485–500.