Treatment of Chemical Mechanical Polishing Wastewater for Water Reuse by Ultrafiltration and Reverse Osmosis Separation

Abstract

This paper describes the treatment of chemical mechanical polishing (CMP) wastewater from a semiconductor plant through membrane-based ultrafiltration (UF) and reverse osmosis (RO) processes to improve the removal efficiency under different water recovery and to determine the possible mechanisms of membrane blocking and rejection. UF pretreatment led to 42.1–46.9% conductivity, 98.1–99.4% turbidity, and 4.5–24.5% total organic carbon (TOC) removal. These contaminants were almost completely rejected after performing subsequent RO processing: the values of the conductivity, turbidity, and TOC were reduced to 6 μS/cm, 0.01 NTU, and 1.6 mg/L, respectively. The water quality of the permeates after UF or RO membrane filtration could meet the water reuse standards for tap water, cooling water, boiler water, and the feed for a water purification machine. The variation with time of the permeate flux for the UF process was fitted to the Hermia model to examine the possible blocking mechanisms during the filtration process. The possible rejection mechanisms of the membrane processes are discussed herein in terms of the water quality variation during the membrane-based separation processes.