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Abstract

An amino-terminated oligoimide was prepared by Michael addition reaction of N, N′-1, 4-phenylene bismaleimide (PBM) and 4, 4′-diamino-diphenyl methane (DDM) at a PBM–DDM ratio of 1:2. The poly(amido-imide)s (PAIs) were prepared by condensation of this PBM–DDM oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies, number-average molecular weight (M _n), estimated by nonaqueous conductometric titration, and thermogravimetry. The curing reaction of the epoxy resin–, namely diglycidyl ether of bisphenol-A (DGEBA)–, PAI system was monitored by differential scanning calorimetry (DSC). Based on cure temperature, the glass- and carbon-fibrereinforced composites (i.e. laminates) of the PAI–epoxy resin system have also been prepared and characterized.

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Poly(Amido-Imide)s Based on Amino-Terminated Oligoimides

Abstract

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