Epoxy-modified polyimides: part I

Abstract

The Michael addition reaction of N,N'-l,4-phenylene bis(maleimide) (PBM) with 4,4'-diamino diphenyl methane (DDM) at 1:1, 1: 1.5 and 1:2 molar ratios was carried out in melt at 125-130'C. The resultant polyimide oligomers (PBM-DDM) were characterized by elemental analysis, number of amino and imino groups, IR spectral studies, number average molecular weight, by non-aqueous conductometric titration, and thermogravimetry. These polyimide oligomers were used to cure epoxy resin, namely diglycidyl ether of bisphenol-A, and studied by differential scanning calorimetry (DSC). The unreinforced PBM-DDM epoxy-cured products have also been prepared and characterized. A preliminary study of glass reinforcement based on the PBM-DDM epoxy system has also been established.

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