To improve the plasma resistance behaviour, glass frits of SiO2–Al2O3–Y2O3 with various powder sizes were coated onto quartz substrates by the aerosol deposition (AD) method. The thickness and microstructure of the coating layers were observed using a surface profiler and scanning electron microscopy. Plasma resistance was measured via the quartz substrate, after exposure to an inductively coupled plasma etcher. The coating layers were densely formed on the quartz substrates without additional heat treatment, and the layer thickness changed for the glass frit size distribution and AD process conditions. The SiO2–Al2O3–Y2O3 glass coating layer showed a higher plasma resistance than quartz. Furthermore, the AD coating layer was evenly etched after plasma exposure. This study improves the lifetime of plasma chamber components in the semiconductor industry.
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