Residual Stress Variation in Polycrystalline Copper during Recrystallization

Abstract

A general multi-reflection method was applied to determine the stress level in deformed and recrystallized polycrystalline copper samples. Different reflections hkl were simultaneously used in the fitting procedure. The anisotropic diffraction elastic constants were calculated using the self-consistent model and crystallographic texture. Important decrease of the first order residual stresses was observed during recovery and recrystallization. Independently, diffraction peak widths and intensities were examined for a few characteristic texture components during the recrystallization process. The importance of cubic orientation grains in the recrystallization process was confirmed.