We investigated the delamination behaviour of diamond-like carbon films on silicon nitride (Si3N4) substrates, considering the effect of the substrates surface roughness. The damage evolution at the film/substrate interface during indentation was simulated using a cohesive zone model, and the interfacial stress and energy release were determined. We discuss the influence of asperity size, thickness and Young's modulus of the films. The results show that the interfacial roughness hastens the onset of interfacial damage but delays the progression of film delamination owing to the effect of mechanical interlocking. The asperity size and film thickness also strong influence the delamination of diamond-like carbon films.
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