The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.
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