In situ spherical TiCp-reinforced copper matrix composites were prepared via hot-pressing sintering assisted with copper plating. Brinell hardness and electrical conductivity of composites with various contents were investigated, room temperature compression properties and fractography of optimal TiCp/Cu composites and sintered pure copper were analysed. It was found that with the increase of TiCp content, Brinell hardness of composites was increased, while electrical conductivity decreased. When TiCp content was 1.0 wt-%, the Brinell hardness increased significantly and the conductivity was maintained at a high level. Compared with sintered pure copper, the yield strength and ultimate compressive strength of the composites were improved, while the fracture strain was reduced.
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