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1-2 of 2 results for ultrasonic wire bonders

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Research article

First published 2003-3

Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging

C M Hu, N Guo, H Du [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2007-8

C M Hu, N Q Guo, H J Du [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science